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FRP玻璃鋼復(fù)合材料論壇

標(biāo)題: [求助]乙烯基樹脂固化體系 [打印本頁]

作者: 還是不很懂    時間: 2005-1-10 19:21
標(biāo)題: [求助]乙烯基樹脂固化體系
請問乙烯基樹脂所用的固化劑和促進(jìn)劑都有哪些?。坑惺裁刺厥庖髥??哪為高人能給我指點指點?!不甚感激.
作者: laney    時間: 2005-1-11 09:49
<>沒啥特別要求啊?!</P><>UP樹脂固化劑、促進(jìn)劑就行的,只是常溫固化系統(tǒng)一般需要增加加速劑</P>
作者: jiahaohui    時間: 2005-1-11 17:19
如果你對FRP質(zhì)量有特別高的要求,是應(yīng)該選用更變合適的固化體系,因為過氧化甲乙酮-鈷體系在乙烯基樹脂中會產(chǎn)生氣泡(類似發(fā)泡),對質(zhì)量有一點影響。
作者: 還是不很懂    時間: 2005-1-12 17:48
<B>以下是引用<I>jiahaohui</I>在2005-1-11 17:19:24的發(fā)言:</B>
如果你對FRP質(zhì)量有特別高的要求,是應(yīng)該選用更變合適的固化體系,因為過氧化甲乙酮-鈷體系在乙烯基樹脂中會產(chǎn)生氣泡(類似發(fā)泡),對質(zhì)量有一點影響。


做防腐地坪的,請問促進(jìn)劑該用多少濃度的合適?產(chǎn)生氣泡可能有影響的,怎么解決?謝謝指點.
作者: taibinsh    時間: 2005-1-13 09:16
<>用的哪家的乙烯基啊</P>
作者: laney    時間: 2005-1-13 21:31
問樹脂供應(yīng)商啊?!讓他們解決最好,每家的VER還是有區(qū)別的
作者: 玻霸    時間: 2005-4-26 17:04
<>哈哈?。”救司椭肋^氧化甲乙酮(MEKP)固化劑,別的就無能為力了哈!!</P>[em01][em01][em01][em01]
作者: 玻霸    時間: 2005-4-28 10:05
又查到一個環(huán)烷酸鈷?。em01][em01][em01]
作者: bamstone    時間: 2005-4-28 10:07
師姐本身不就是賣促進(jìn)劑的么??
作者: 玻霸    時間: 2005-4-28 11:57
<>師姐師兄好?。。⌒〉芪沂浅鮼碚У?,以后多多指導(dǎo)一下師弟哈!!</P><>[em01][em01][em01][em01]</P>
作者: 團長    時間: 2005-5-5 22:51
<>這種樹脂一般固化的要慢一些.因為在生產(chǎn)過程中要加入更多的阻聚劑.</P><>所以</P><>促進(jìn)劑要用濃度高一點的!</P>
作者: alexwtt    時間: 2005-9-21 13:44
(</B>固化系統(tǒng)(</B>Curing System</B>):</B><p></p></B></P>FUCHEM系列乙烯基酯樹脂一般為非預(yù)促進(jìn)樹脂,固化系統(tǒng)與通用不飽和樹脂類似,在室溫或90℃以下固化時,應(yīng)該加入固化劑和促進(jìn)劑,但因根據(jù)成型工藝、作業(yè)溫度、制品厚度、濕度大小等調(diào)整相應(yīng)的加入量,同時根據(jù)不同的情況選用不同類型的固化系統(tǒng)。(The basic range of FUCHEM VER are unpromoted and required the addition of both accelerators and promoters just like general UPR. The selection criteria of the curing system and amounts depend on the desired gel time, the temperature of both the resin and workshop, the laminate thickness, humidity, impurities and the posting-curing possibilities.))</P><p> </p></B></P>低溫固化</B>(Low Temp Curing)</B>:</B><p></p></B></P>當(dāng)制品必須在10℃以下固化時(如:室外粘接與修補,防腐蝕內(nèi)襯等),下面的系統(tǒng)可用于0-10℃,也可用釩類促進(jìn)劑。(If to be handled below 10℃, for example outdoors adhesion or anti-corrosion lining, the below curing system is recommended.)<p></p></P>MEKP/AAP<p></p></P>Cobalt-6%<p></p></P>DMA-100%<p></p></P>2.0-2.5%<p></p></P>7-10%<p></p></P>0.1-0.6%<p></p></P><p> </p></B></P>室溫固化</B>(RT Curing)</B>:</B><p></p></B></P>MEKP</B>系統(tǒng)</B>(MEKP Curing System)</B>:</B><p></p></B></P>為常用固化系統(tǒng),使用時加速劑、促進(jìn)劑及固化劑必須分別加入,且每加一種時,都必須充分混合均勻,方可加入第二種,添加順序為:加速劑→促進(jìn)劑→固化劑。當(dāng)要求膠凝時間和固化時間較快或固化薄層制品時,可以用過氧化乙酰丙 酮(AAP)取代MEKP;另外適量的DMA加入可以獲得良好的固化效果。(This system is frequent used, and it is important to mix these additives into the resin as follows: first the Cobalt Naphthalene(CoNAP) or Cobalt Octoate(CoOCT) or Dimethyl Aniline(DMA) and then Methyl Ethyl Ketone(MEKP), also thorough mixing is necessary to get optimum results. In case of thick laminating or short gel time required, AAP is a good accelerator instead of MEKP, meanwhile some DMA is recommended to ensure optimum curing.)<p></p></P>MEKP-55%<p></p></P>Cobalt-6%<p></p></P>DMA-100%<p></p></P>0.9-2.5%<p></p></P>0.2-0.5%<p></p></P>0.0-0.2%<p></p></P><p> </p></P>BPO</B>系統(tǒng)</B>(BPO Curing System)</B>:</B><p></p></B></P>該系統(tǒng)可以獲得較好的固化性能,比較適用于一些濕度相對較高的使用場合,另外也應(yīng)用于一些MEKP/Co固化系統(tǒng)不適用的防腐蝕場合(如含次氯酸離子介質(zhì)等)。(Benzoly Peroxide (BPO) curing system is also suitable for VER yielding better curing, quite ideal for high humidity cases, and this system shall replace MEKP system in some special case such as hypochlorite-contact fabrication.)</P>DMA-100%<p></p></B></P>BPO-98%<p></p></B></P>0.05-0.2%<p></p></B></P>1.0-2.0%<p></p></B></P><p> </p></B></P>中高溫固化</B>(Elevated Temp Curing)</B>:</B><p></p></B></P>適用于FUCHEM乙烯基酯樹脂的中高溫固化劑與通用UP相同,對于熱模壓或拉擠等工藝適合,常見的有BPO和叔丁基過苯甲酸酯(TBPB或1,1-二(過氧化叔丁基)-3,3,5-三甲基環(huán)已烷(DTBTC))系統(tǒng),以獲的良好的固化效果和縮短固化時間;在高速拉擠工藝中,可加入適量的高活性過氧化碳酸酯。(BPO is commonly used yielding longer pot life, yet rapid curing is obtained at temp above 80℃. Combinations of different peroxides (such as TBPB or DTDTC) are recommended in order to obtain optimum properties and reduce curing time, these are suitable for pultrusion or thermal-molding. And some positive peresters are recommended in speed pultrusion.)<p></p></P><p> </p></B></P>低放熱峰系統(tǒng)</B>(Low Exotherm Curing)</B>:</B><p></p></B></P>在較厚鋪層結(jié)構(gòu)或平板制作中,要求較低的放熱峰以控制最小的翹曲和防止分層,應(yīng)推薦異丙苯過氧化氫系統(tǒng)(CuHP)系統(tǒng),該系統(tǒng)也不產(chǎn)生氣泡,在RTM工藝中可推薦使用;若要求放熱峰值低于100℃,推薦使用CuHP和特丁基過氧化氫的混合物;另外錳鹽促進(jìn)劑可產(chǎn)生較低的放熱峰。(In the production of thick laminates or wet-on-wet above 5mm, lower exothermic heat to avoid over-heating is necessary, which in turn could lead to delaminating, increased shrinkage and possible warping, Cume Hydroperoxide (CuHP) is recommended instead of others, on the other hand, CuHP does not create any foaming and specially recommended for RTM applications. When exothermic peak below 100℃ is necessary, Tertiary Butyl Hydroperoxide(TBPO)is maybe employed in combination with CuHP.)<p></p></P>       <p></p></B></P>后固化(Post Curing)</B>:<p></p></B></P>為使FUCHEM高性能樹脂獲得最佳的耐熱性和耐腐蝕性,如接觸食品、強腐蝕性環(huán)境的FRP,后固化是十分必要的。推薦的后固化條件是90~100℃,3~6小時——對于厚制品和形狀比較復(fù)雜的制品,后固化時間需要更長。比較低的后固化溫度是沒有效果的,一般可以通過干熱空氣或加熱器進(jìn)行加溫,同時可以用油布包覆以提高效果。但過高的溫度會導(dǎo)致脆裂,應(yīng)防止局部過熱。在制品制作完畢后,后固化處理應(yīng)盡快進(jìn)行以提高效率。(The performance of composite can be enhanced by post curing the finished component at elevated temperatures, especially for these used in aggressive environments or for contact with food. For maximum effectiveness, post curing at 90-100℃ should be performed 3-6 hours as soon as possible after the composite has gelled and its exotherm has subsided. For large components, post curing should be practised as soon at the composite structure is completed. This post curing should be done with hot dry air or heater, yet hot spots should be avoided, a good technique for improving heating efficiency is to cover the post curing vessel or laminate with a tarpaulin.)</P><p> </p></P>
作者: 白秀才    時間: 2005-9-22 00:00
<>頂~~~~~~~~</P>
作者: alexwtt    時間: 2005-9-22 12:52
標(biāo)題: 固化體系
(</B>固化系統(tǒng)(</B>Curing System</B>):</B>

</B>
<p>FUCHEM系列乙烯基酯樹脂一般為非預(yù)促進(jìn)樹脂,固化系統(tǒng)與通用不飽和樹脂類似,在室溫或90℃以下固化時,應(yīng)該加入固化劑和促進(jìn)劑,但因根據(jù)成型工藝、作業(yè)溫度、制品厚度、濕度大小等調(diào)整相應(yīng)的加入量,同時根據(jù)不同的情況選用不同類型的固化系統(tǒng)。(The basic range of FUCHEM VER are unpromoted and required the addition of both accelerators and promoters just like general UPR. The selection criteria of the curing system and amounts depend on the desired gel time, the temperature of both the resin and workshop, the laminate thickness, humidity, impurities and the posting-curing possibilities.))
<p>
<p></B>
<p>低溫固化</B>(Low Temp Curing)</B>:</B>
<p></B>
<p>當(dāng)制品必須在10℃以下固化時(如:室外粘接與修補,防腐蝕內(nèi)襯等),下面的系統(tǒng)可用于0-10℃,也可用釩類促進(jìn)劑。(If to be handled below 10℃, for example outdoors adhesion or anti-corrosion lining, the below curing system is recommended.)
<p>
<p>MEKP/AAP
<p>
<p>Cobalt-6%
<p>
<p>DMA-100%
<p>
<p>2.0-2.5%
<p>
<p>7-10%
<p>
<p>0.1-0.6%
<p>
<p>
<p></B>
<p>室溫固化</B>(RT Curing)</B>:</B>
<p></B>
<p>MEKP</B>系統(tǒng)</B>(MEKP Curing System)</B>:</B>
<p></B>
<p>為常用固化系統(tǒng),使用時加速劑、促進(jìn)劑及固化劑必須分別加入,且每加一種時,都必須充分混合均勻,方可加入第二種,添加順序為:加速劑→促進(jìn)劑→固化劑。當(dāng)要求膠凝時間和固化時間較快或固化薄層制品時,可以用過氧化乙酰丙 酮(AAP)取代MEKP;另外適量的DMA加入可以獲得良好的固化效果。(This system is frequent used, and it is important to mix these additives into the resin as follows: first the Cobalt Naphthalene(CoNAP) or Cobalt Octoate(CoOCT) or Dimethyl Aniline(DMA) and then Methyl Ethyl Ketone(MEKP), also thorough mixing is necessary to get optimum results. In case of thick laminating or short gel time required, AAP is a good accelerator instead of MEKP, meanwhile some DMA is recommended to ensure optimum curing.)
<p>
<p>MEKP-55%
<p>
<p>Cobalt-6%
<p>
<p>DMA-100%
<p>
<p>0.9-2.5%
<p>
<p>0.2-0.5%
<p>
<p>0.0-0.2%
<p>
<p>
<p>
<p>BPO</B>系統(tǒng)</B>(BPO Curing System)</B>:</B>
<p></B>
<p>該系統(tǒng)可以獲得較好的固化性能,比較適用于一些濕度相對較高的使用場合,另外也應(yīng)用于一些MEKP/Co固化系統(tǒng)不適用的防腐蝕場合(如含次氯酸離子介質(zhì)等)。(Benzoly Peroxide (BPO) curing system is also suitable for VER yielding better curing, quite ideal for high humidity cases, and this system shall replace MEKP system in some special case such as hypochlorite-contact fabrication.)
<p>DMA-100%
<p></B>
<p>BPO-98%
<p></B>
<p>0.05-0.2%
<p></B>
<p>1.0-2.0%
<p></B>
<p>
<p></B>
<p>中高溫固化</B>(Elevated Temp Curing)</B>:</B>
<p></B>
<p>適用于FUCHEM乙烯基酯樹脂的中高溫固化劑與通用UP相同,對于熱模壓或拉擠等工藝適合,常見的有BPO和叔丁基過苯甲酸酯(TBPB或1,1-二(過氧化叔丁基)-3,3,5-三甲基環(huán)已烷(DTBTC))系統(tǒng),以獲的良好的固化效果和縮短固化時間;在高速拉擠工藝中,可加入適量的高活性過氧化碳酸酯。(BPO is commonly used yielding longer pot life, yet rapid curing is obtained at temp above 80℃. Combinations of different peroxides (such as TBPB or DTDTC) are recommended in order to obtain optimum properties and reduce curing time, these are suitable for pultrusion or thermal-molding. And some positive peresters are recommended in speed pultrusion.)
<p>
<p>
<p></B>
<p>低放熱峰系統(tǒng)</B>(Low Exotherm Curing)</B>:</B>
<p></B>
<p>在較厚鋪層結(jié)構(gòu)或平板制作中,要求較低的放熱峰以控制最小的翹曲和防止分層,應(yīng)推薦異丙苯過氧化氫系統(tǒng)(CuHP)系統(tǒng),該系統(tǒng)也不產(chǎn)生氣泡,在RTM工藝中可推薦使用;若要求放熱峰值低于100℃,推薦使用CuHP和特丁基過氧化氫的混合物;另外錳鹽促進(jìn)劑可產(chǎn)生較低的放熱峰。(In the production of thick laminates or wet-on-wet above 5mm, lower exothermic heat to avoid over-heating is necessary, which in turn could lead to delaminating, increased shrinkage and possible warping, Cume Hydroperoxide (CuHP) is recommended instead of others, on the other hand, CuHP does not create any foaming and specially recommended for RTM applications. When exothermic peak below 100℃ is necessary, Tertiary Butyl Hydroperoxide(TBPO)is maybe employed in combination with CuHP.)
<p>
<p>      
<p></B>
<p>后固化(Post Curing)</B>:
<p></B>
<p>為使FUCHEM高性能樹脂獲得最佳的耐熱性和耐腐蝕性,如接觸食品、強腐蝕性環(huán)境的FRP,后固化是十分必要的。推薦的后固化條件是90~100℃,3~6小時——對于厚制品和形狀比較復(fù)雜的制品,后固化時間需要更長。比較低的后固化溫度是沒有效果的,一般可以通過干熱空氣或加熱器進(jìn)行加溫,同時可以用油布包覆以提高效果。但過高的溫度會導(dǎo)致脆裂,應(yīng)防止局部過熱。在制品制作完畢后,后固化處理應(yīng)盡快進(jìn)行以提高效率。(The performance of composite can be enhanced by post curing the finished component at elevated temperatures, especially for these used in aggressive environments or for contact with food. For maximum effectiveness, post curing at 90-100℃ should be performed 3-6 hours as soon as possible after the composite has gelled and its exotherm has subsided. For large components, post curing should be practised as soon at the composite structure is completed. This post curing should be done with hot dry air or heater, yet hot spots should be avoided, a good technique for improving heating efficiency is to cover the post curing vessel or laminate with a tarpaulin.)
作者: 開心蜜蜂    時間: 2005-12-31 14:19
真的夠high的[em05]
作者: sinofrp    時間: 2006-3-29 21:35
<>請教一下alexwtt老兄:</P><>DMA應(yīng)該是二甲基苯胺吧。不過市場上的二甲基苯胺有好多種異構(gòu)體,應(yīng)該用哪種呢?</P><> </P>
作者: laney    時間: 2006-3-30 10:39
<>N,N-二甲基苯胺</P>
作者: Housen    時間: 2006-4-3 10:03
<>你用的是哪家的乙烯基呀?</P>
作者: alexwtt    時間: 2006-8-11 15:19
http://www.ywbdwj.cn/bbs/read.php?tid=2879&fpage=5
作者: april_zhuo    時間: 2006-8-27 22:18
固化劑二叔戊基在中高溫固化系統(tǒng)中的效果怎樣?
二叔戊基比過氧化苯甲酸叔丁酯的半衰期溫度要高,
而且不容易黃變.固化速度等其他方面也比過氧化苯甲酸叔丁酯要好.
作者: yunwater2042    時間: 2006-9-1 08:46
引用第19樓april_zhuo2006-08-27 22:18發(fā)表的“”:
固化劑二叔戊基在中高溫固化系統(tǒng)中的效果怎樣?
二叔戊基比過氧化苯甲酸叔丁酯的半衰期溫度要高,
而且不容易黃變.固化速度等其他方面也比過氧化苯甲酸叔丁酯要好.



二叔戊基?  是什么東西呢? [s:6]
作者: laney    時間: 2006-9-1 16:07
二叔戊基過氧化物么~
可以用在熱固性FRP中作固化劑么~沒聽過呢~ [s:5]
作者: 原弛蠟象    時間: 2006-9-23 11:36
標(biāo)題: 求指點加工用乙稀噴出來的產(chǎn)品
請各位大佬們看看這個產(chǎn)品怎么做。小姓章,13590708448
http://photo.163.com/photos/austin-zzf/73785052/
作者: laney    時間: 2006-9-23 23:15
沒看明白 [s:3]  [s:5]  [s:5]  [s:5]
作者: 韻新    時間: 2006-12-28 16:18
王天堂先生不是寫的嗎,copy過來的吧,我看過您寫的這邊固化配方的文章,但是好像你這里解釋的只是僅僅富臣的樹脂的配方吧。

我用過樹脂,我覺得好像每家都有各自的特點,還是樹脂供應(yīng)商自己對自己的樹脂最了界了,還是直接問樹脂供應(yīng)商吧。

因為做促進(jìn)機的一般都不做固化劑,做固化劑的一般又不作促進(jìn)機,這樣問他們,他們也得做試驗,反正樹脂廠家不可能對自己樹脂都沒有個推薦配方吧。




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